SIA406DJ Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 12-V (D-S) MOSFET

New Product
N-Channel 12-V (D-S) MOSFET
SiA406DJ
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.0198 at V_GS = 4.5 V
12
0.0222 at V_GS = 2.5 V
0.0264 at V_GS = 1.8 V
I_D (A)^a
4.5
4.5
4.5
Q_g (Typ.)
13.7 nC
PowerPAK SC-70-6L-Single
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
SC-70 Package
- Small Footprint Area
- Low On-Resistance
• 100 % R_g Tested
• Compliant to RoHS Directive 2002/95/EC
D
6
D
5
2.05 mm ^S
4
1
D
2
D
3
G
S
2.05 mm
Marking Code
APPLICATIONS
• Load Switch for Portable Devices
• DC/DC Converters
Part # code
AHX
XXX
Lot Traceability
and Date code
Ordering Information: SiA406DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
12
V
V_GS
±8
T_C = 25 °C
4.5^a
Continuous Drain Current (T_J = 150 °C)^a
T_C = 70 °C
T_A = 25 °C
I_D
4.5^a
4.5^{a, b, c}
T_A = 70 °C
4.5^{a, b, c}
A
Pulsed Drain Current
I_DM
20
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
4.5^a
2.9^{b, c}
T_C = 25 °C
19
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
12
3.5^{b, c}
W
T_A = 70 °C
2.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
Steady State
Symbol
R_thJA
R_thJC
Typical
28
5.3
Maximum
36
6.5
Unit
°C/W
Notes:
a. Package limited
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
Document Number: 65361
S09-1924-Rev. A, 28-Sep-09
www.vishay.com
1