SI5458DU Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 30-V (D-S) MOSFET

New Product
N-Channel 30-V (D-S) MOSFET
Si5458DU
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.041 at V_GS = 10 V
30
0.051 at V_GS = 4.5 V
I_D (A)^{d, e}
6
6
Q_g (Typ.)
2.8 nC
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• 100 % R_g Tested
• Compliant to RoHS Directive 2002/95/EC
PowerPAK^® ChipFET Single
1
2
D
3
D
D
4
8
D
7
D
6
S
D
G
S
5
APPLICATIONS
• Load Switch
• HDD DC/DC
Marking Code
AP XXX
Lot Traceability
and Date Code
Part # Code
Bottom View
Ordering Information: Si5458DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
D
(1, 2, 3, 6, 7, 8)
G
(4)
(5)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V
V_GS
± 20
T_C = 25 °C
6^e
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
6^e
6^{a, b, e}
T_A = 70 °C
6^{a, b, e}
A
Pulsed Drain Current
I_DM
20
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
6
2.9^{a, b}
T_C = 25 °C
10.4
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
6.7
3.5^{a, b}
W
T_A = 70 °C
2.2^{a, b}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{f, g}
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{a, c}
t≤5s
R_thJA
30
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
10
36
°C/W
12
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. t = 5 s.
c. Maximum under steady state conditions is 72 °C/W.
d. Based on T_C = 25 °C.
e. Package limited.
f. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
g. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 65019
S09-1392-Rev. A, 20-Jul-09
www.vishay.com
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