U3665M Datasheet, PDF (8/9 Pages) TEMIC Semiconductors – Baseband Delay Line 64 us (Improved Version)

U3665M
Package Information
Package DIP16
20.0 max
7.82
Dimensions in mm
19.8 max
7.42
Alternative
4.8 max
0.5 min
3.3
1.64
0.58
1.44
0.48
2.54
17.78
16
15
14
13
12
11
10
9
6.4 max
0.39 max
9.75
8.15
Package SO16
Dimensions in mm
1
2
3
4
5
6
7
8
technical drawings
according to DIN
specifications
96 11709
94 8875
8 (9)
TELEFUNKEN Semiconductors
Preliminary Information
Rev. A1, 17-Jul-96