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U6268B Datasheet, PDF (2/12 Pages) TEMIC Semiconductors – Side-Airbag Sensor Dual Interface
U6268B
Pin Description
GND 1
RETURN1 2
OUT1 3
VS 4
OUT2 5
SC 6
RETURN2 7
GND 8
13321
Figure 2. Pinning
16 GND
Pin Symbol
1
GND
2 RETURN1
15 ENABLE1
14 CLL1
13 OCM1
12 OCM2
11 CLL2
10 ENABLE2
9 GND
3
OUT1
4
VS
5
OUT2
6
SC
7 RETURN2
8, 9 GND
10 ENABLE1
11
CLL2
12 OCM2
13 OCM1
14
CLL1
15 ENABLE2
16
GND
Figure 3. Application circuit
Function
Ground and reference pin
Return line of the external unit,
internally connected to GND via
a line-protection transistor
Voltage-stabilized supply output
and current-modulation input
Supply voltage of the IC
Voltage stabilized supply output
and current modulation input
Smooth time constant for slow
voltage change at both OUT
pins
Return line of the external unit,
internally connected to GND via
a line-protection transistor
Ground and reference pin
Controls OUT1 voltage,
ENABLE1 High means OUT1
active, ENABLE1 Low or open
means OUT1 switched off
Current logic level output, low
at high OUT2 current,
monitoring via OCM2
Analog current output, repre-
senting 1/10 current of OUT2
Analog current output, repre-
senting 1/10 current of OUT1
Current logic level output, low
at high OUT1 current, moni-
toring via OCM1
Controls OUT2 voltage,
ENABLE2 High means OUT2
active, ENABLE1 Low or open
means OUT2 switched off
Ground and reference pin
Functional Description
VS
The IC and the external units are powered via the VS
Pin 4. This pin is connected to the battery via a reverse
battery protection diode. An electrolythic capacitor of
22 mF smoothes the voltage and absorbes positive and
negative transients.
OUT1, OUT2
OUTx provides a smoothed, very slowly changing supply
voltage for the external units and monitors the output cur-
rent. During normal operating conditions, the OUTx
voltage is typ. 3 V below VS, and changes very slowly
with a varying battery voltage in order to suppress distur-
bances in the data transmission. At low VS (5.7 to 8.5 V),
the OUTx voltage is typ. 0.5 V below VS. This voltage
difference is reduced in order to ensure sufficient supply
voltage for the external unit between OUTx and
RETURNx. The output current capability is 50 mA. The
internal pull-down current at OUTx is typically 3 mA.
2 (12)
TELEFUNKEN Semiconductors
Preliminary Information
Rev. A1, 21-May-97