MS5837-30BA Datasheet, PDF (14/16 Pages) TE Connectivity Ltd – Ultra Small Gel Filled Pressure Sensor

MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
RECOMMENDED PAD LAYOUT
Pad layout for bottom side of the MS5837-30BA soldered onto printed circuit board.
SHIPPING PACKAGE
Recommended PCB footprint
SENSOR SOLUTIONS /// MS5837-30BA
03/12/2015
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