MS5837-30BA Datasheet, PDF (1/16 Pages) TE Connectivity Ltd – Ultra Small Gel Filled Pressure Sensor

MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SPECIFICATIONS
 Ceramic - metal package, 3.3 x 3.3 x 2.75mm
 High-resolution module 0.2 mbar
 Fast conversion down to 0.5 ms
 Low power, 0.6 µA (standby < 0.1 µA at 25°C)
 Integrated digital pressure sensor (24 bit ΔΣ ADC)
 Supply voltage 1.5 to 3.6 V
 Operating range: 0 to 30 bar, -20 to +85 °C
 I²C interface
 No external components (Internal oscillator)
 Excellent long term stability
 Hermetically sealable for outdoor devices
 Sealing designed for 1.8 x 0.8mm O-ring
The MS5837-30BA is a new generation of high resolution
pressure sensors with I²C bus interface for dept h
measurement systems with a water depth resolution of 2 mm.
The sensor module includes a high linearity pressure sensor
and an ultra-low power 24 bit ΔΣ ADC with int ernal factory
calibrated coefficients. It provides a precise digit al 24 Bit
pressure and temperature value and different operation modes
that allow the user to optimize for conversion speed and
current consumption. A high resolution temperature output
allows the implementation in depth measurement systems and
thermometer function without any additional sensor. The
MS5837-30BA can be interfaced to virtually any
microcontroller. The communication protocol is simple, without
the need of programming internal registers in the device. The
gel protection and antimagnetic stainless steel cap make the
module water resistant. This new sensor module generation is
based on leading MEMS technology and latest benefits from
MEAS Switzerland proven experience and know -how in high
volume manufacturing, which has been widely used for over a
decade.
SENSOR SOLUTIONS /// MS5837-30BA
03/12/2015
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