MS5541-30C Datasheet, PDF (13/19 Pages) Intersema Sensoric SA – MINIATURE 30 bar MODULE

MS5541-30C
Miniature 30 bar Module
APPLICATION INFORMATION
GENERAL
The advantage for this combination of a sensor with a directly adapted integrated circuit is to save other external
components and to achieve very low power consumption. The main application field for this system includes
portable devices with battery supply, but its high accuracy and resolution make it also suited for industrial and
automotive applications. The possibility to compensate the sensor with software allows the user to adapt it to his
particular application. Communication between the MS5541-30C and the widely available microcontrollers is
realised over an easy-to-use 3-wire serial interface. Customers may select which microcontroller system to be used,
and there are no specific standard interface cells required, which may be of interest for specially designed 4 Bit-
microcontroller applications.
CALIBRATION
The MS5541-30C is factory calibrated. The calibration data is stored inside the 64 bit PROM memory.
SOLDERING
Please refer to the application note AN808 for all soldering issues.
HUMIDITY, WATER PROTECTION
The silicon pressure transducer and the bonding wires are protected by an anticorrosive and antimagnetic protection
cap. The MS5541-30C carries a metal protection cap filled with silicone gel for enhanced protection against
humidity. The properties of this gel ensure function of the sensor even when in direct water contact. This feature
can be useful for waterproof watches or other applications, where direct water contact cannot be avoided.
Nevertheless the user should avoid drying of hard materials like for example salt particles on the silicone gel surface.
In this case it is better to rinse with clean water afterwards. Special care has to be taken to not mechanically damage
the gel. Damaged gel could lead to air entrapment and consequently to unstable sensor signal, especially if the
damage is close to the sensor surface.
The metal protection cap is fabricated of special anticorrosive and antimagnetic stainless steel in order to avoid any
corrosive battery effects inside the final product.
For underwater operations it is important to seal the sensor with a rubber O-Ring around the metal ring. Any salt
water coming to the contact side (ceramic and Pads) of the sensor could lead to permanent damage.
LIGHT SENSITIVITY
The MS5541-30C is protected against sunlight by a layer of white gel. It is, however, important to note that the
sensor may still be slightly sensitive to sunlight, especially to infrared light sources. This is due to the strong photo
effect of silicon. As the effect is reversible there will be no damage, but the user has to take care that in the final
product the sensor cannot be exposed to direct light during operation. This can be achieved for instance by placing
mechanical parts with holes in such that light cannot pass.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB to connect it. This can be important for
applications in watches and other special devices, and will also reduce mechanical stress on the device.
For applications subjected to mechanical shock, it is recommended to enhance the mechanical reliability of the
solder junctions by covering the rim or the corners of MS5541-30C's ceramic substrate with glue or Globtop-like
material.
SENSOR SOLUTIONS ///MS5541-30C
09/2015
Page 13