C0402C0G1C330KT Datasheet, PDF (7/34 Pages) TDK Electronics – MULTILAYER CERAMIC CHIP CAPACITORS

(continued)
No.
Item
11 Solderability
Performance
(C0402)
Both end faces and the contact areas
shall be covered with a smooth and
bright solder coating with no more than
a small amount of scattered
imperfections such as pinholes or
un-wetted or de-wetted areas.
These imperfections shall not be
concentrated in one area.
(Others)
New solder to cover over 75% of termination.
25% may have pin holes or rough spots
but not concentrated in one spot.
Ceramic surface of A sections shall not
be exposed due to melting or shifting of
termination material.
Test or inspection method
Completely soak both terminations in
solder at 235±5°C for 2 ± 0.5s.
Solder : H63A (JIS Z 3282)
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid
solution.
Only reflow soldering applicable to
C0402.
Peak condition
Temp. : 235±5°C
Time: 2±0.5s.
Preheating condition
Temp. : 150±10°C
Time: 1 to 2min.
A section
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