C0402C0G1C330KT Datasheet, PDF (13/34 Pages) TDK Electronics – MULTILAYER CERAMIC CHIP CAPACITORS

Appendix - 1a
P.C. Board for reliability test
Applied for C0402, C0603, C1005, C1608, C2012, C3216
100
c
Appendix - 1b
P.C. Board for reliability test
Applied for C3225, C4532, C5750
100
c
Solder resist
Copper
(Unit：mm)
Appendix - 2a
P.C. Board for bending test
Applied for C0402, C0603, C1005
Slit
Solder resist Copper
(Unit : mm)
Appendix - 2b
P.C. Board for bending test
Applied for C1608, C2012, C3216, C3225, C4532, C5750
100
100
b
b
a
Solder resist
(Unit : mm)
a
b
Copper
Solder resist
Copper
(Unit : mm)
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness : Appendix-2a
Appendix-1a, 1b, 2b
0.8mm
1.6mm
Copper ( thickness 0.035mm )
Solder resist
TDK (EIA style)
C0402 (CC01005)
C0603 (CC0201)
C1005 (CC0402)
C1608 (CC0603)
C2012 (CC0805)
C3216 (CC1206)
C3225 (CC1210)
C4532 (CC1812)
C5750 (CC2220)
Dimensions (mm)
a
b
c
0.2
0.8
0.2
0.3
0.8
0.3
0.4
1.5
0.5
1.0
3.0
1.2
1.2
4.0 1.65
2.2
5.0
2.0
2.2
5.0
2.9
3.5
7.0
3.7
4.5
8.0
5.6
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