MLZ1608A2R2WT Datasheet, PDF (5/11 Pages) TDK Electronics – Inductors for Decoupling Circuits

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Inductors for Decoupling Circuits
Multilayer/STD • Magnetic Shielded
Conformity to RoHS Directive
MLZ Series MLZ1608
The MLZ Series is a line of multilayer choke coils for decoupling
power circuits.
The MLZ1608-W Series, a line of the MLZ Series, has increased
its DC superimposition characteristics by up to 225%^ compared
with existing products through the use of TDK's proprietary ferrite
material technology.
Also available is the MLZ1608-L Series. This series has lowered its
resistance by up to 40% compared with existing products through
the adoption of a new ferrite material and dense electrodes. This
series includes the E3 Series, which handles 1.0 to 10µH, hence it
is extremely useful in the power-supply design of low-voltage cir-
cuits.
FEATURES
• The W Series (IDC UP type) is a line of products that have
achieved the industry's best^ DC superimposition characteristics.
 _{According to research conducted in August 2010.}
• The L Series (Low-resistance type) has lowered its resistance by
up to 40% compared with existing products.
• The D Series (High frequency type) is a line of decoupling coil
products for high frequencies. It can handle higher noise
frequencies.
PRODUCT IDENTIFICATION
MLZ 1608 A 1R0 W T
(1) (2) (3) (4) (5) (6) (7)
(1) Series name
(2) Dimensions LW
1608
1.60.8mm
(3) Management symbol
(4) Inductance
R10
1R0
100
0.1H
1.0 H
10.0 H
(5) Characteristic type
D
W
L
High frequency type
IDC-UP type
Low-resistance type
(6) Packaging style
T
Taping [reel]
APPLICATIONS
Modules such as digital cellular phone and camera module, Net-
books, note PCs, DSCs, DVCs, video games, portable memory
audio devices, navigation systems, PNDs, TVs, W-LANs, solid
state drives
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
4000 pieces/reel
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
[Including self-temperature rise]
–55 to +125°C(After mount)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
250 to 260˚C
230˚C
180˚C
150˚C
Preheating
60 to 120s
10s max.
Natural
cooling
Soldering
30 to 60s
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
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