MLZ1608A2R2WT Datasheet, PDF (2/11 Pages) TDK Electronics – Inductors for Decoupling Circuits

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Inductors for Decoupling Circuits
Multilayer/STD • Magnetic Shielded
Conformity to RoHS Directive
MLZ Series MLZ1005W
The MLZ Series is a new line of multilayer choke coils for decou-
pling with the industry’s best DC superimposition characteristics
and lowest DC resistance^. TDK has developed this coil using its
proprietary ferrite material technique and dense electrodes.
The MLZ Series exerts an excellent effect mainly on the decou-
pling of power circuits. It also exerts an effect on audio lines
because of its low DC resistance.
The MLZ1005 series is now available in addition to the MLZ1608/
2012 series.
 _{The MLZ Series was regarded as having the industry’ s best DC}
superimposition characteristics and lowest DC resistance according to
research conducted in September 2010.
FEATURES
• MLZ10005 series products have the best DC superimposition
characteristics in the industry.
• Magnetically sealed configuration allowing for high-density
mounting.
• Does not contain lead and is compatible with lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Modules such as digital cellular phone and camera module, Net-
books, note PCs, DSCs, DVCs, video games, portable memory
audio devices, navigation systems, PNDs, TVs, W-LANs, solid
state drives
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
[Including self-temperature rise]
–55 to +125°C(After mount)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
250 to 260˚C
230˚C
10s max.
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
PRODUCT IDENTIFICATION
MLZ 1005 M 1R0 W T
(1) (2) (3) (4) (5) (6) (7)
(1) Series name
(2) Dimensions LW
1005
1.00.50.5mm
(3) Management symbol
(4) Inductance
R47
1R0
0.47H
1.0H
(5) Characteristic type
W
IDC-UP
(6) Packaging style
T
Taping [reel]
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
10000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
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