BCS5030G1 Datasheet, PDF (5/5 Pages) TDK Electronics – Visible Radiant Optical Sensor

Recommended land pattern
Recommended land pattern is shown in Fig. Please arrange a land in the direction
as shown in Fig. to the direction of curvature as the result of heat stress by reflow
and/or physical stress.
0.45
0.45
(mm) Stress
0.65 0.5 0.65
Recommanded reflow heat condition
For Pb-Free soldering process
245deg./C - 255deg./C (MAX. 255deg./C)
230deg./C
cooled gradually
180deg./C
150deg./C
60sec.-120sec.
30sec - 40sec
For Pb-Sn soldering process
*Pb Flee Solder is SnAgCu.
220deg./C
200deg./C
cooled gradually
150deg./C
60sec.-100sec.
Less than 40sec