B57342V5103H060 Datasheet, PDF (5/23 Pages) TDK Electronics – NTC thermistors for temperature measurement

Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V5
Automotive series
Test
Resistance to
soldering heat
ESD
Solderability
Electrical
characterization
Flammability
Board flex
Terminal strength
Resistance drift
after soldering
Standard
Test conditions
MIL-STD-202, Dip: 260 °C; 10 s
method 210 1 heat cycle
AEC-Q200-002, Discharge capacitance: 150 pF
method -002 Discharge resistance: 2 kΩ
Charging voltage: 6 kV
Contact discharge
2 pulses in each polarity
J-STD-002
a) Dip: 235 °C; 5 s:
aging 4 h @ 155 °C
b) Dip: 215 °C; 5 s:
steam aging 8 h @ 92 °C
c) Dip: 260 °C; 7 s:
steam aging 8 h @ 92 °C
R(25 °C), R(100 °C), B(25/100)
UL-94
Not applicable for SMD thermistors
V-0 or V-1
(component is not coated or
encapsulated with plastic
materials)
AEC-Q200-005, Max. bending: 2 mm
method -005 Duration @ max. bending: 60 s
AEC-Q200-006, Max. F: 10 N
method -006
Reflow soldering profile
Wave soldering profile
∆R₂₅/R₂₅ Remarks
(typical)
< 3%³⁾
< 5%⁴⁾
95% of
termination
wetted
Within the
specified
values
< 5%⁵⁾
< 5%⁵⁾
< 1%
3) Except B57332V5103+360 ∆R25/R25 (typical) < 1%
4) Except B57332V5103+360 ∆R25/R25 (typical) < 3%
5) Except B57332V5103+360 ∆R25/R25 (typical) < 2%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 23