SESUB-PAN-D14580 Datasheet, PDF (3/4 Pages) TDK Electronics – Micro Modules

(3/4)
Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB)
SESUB-PAN-D14580
SHAPE & DIMENSIONS
3.5mm
0.5mm pitch
Solder Bumped BGA
36pins
Production Part is over molded
ELECTRICAL CHARACTERISTICS
CHARACTERISTICS SPECIFICATION TABLE
Communication standard
Transmitter output power level
Receiver sensitivity level
Host Interface
Peripheral Interface
Current consumption
2.4GHz Bluetooth^® V4.1 Low Energy
0dBm (typ)
94dBm
UART (2ch)/ SPI+ / I2C (100k/400kHz)
10bits ADC (4ch) / Pin-configurable GPIO
5.0mA (Tx), 5.4mA (Rx), 0.8μA (Deep Sleep mode)
RF CHARACTERISTICS
Frequency vs. TX Power
3.0
2.0
1.0
0.0
#3
#1
–1.0
#2
–2.0
–3.0
2402 2412 2422 2432 2442 2452 2462 2472 2482
Frequency (MHz)
Frequency vs. Sensitivity
–60
–65
–70
–75
–80
–85
–90
#3
–95
#1
#2
–100
2402 2412 2422 2432 2442 2452 2462 2472 2482
Frequency (MHz)
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
For product inquiries: [e-mail]
20150928 / sesub-pan-d14580_en.fm