SESUB-PAN-D14580 Datasheet, PDF (2/4 Pages) TDK Electronics – Micro Modules

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Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB)
Micro Modules
(Substrates with Built-in ICs, Products Utilizing with SESUB)
Bluetooth^® V4.1 Smart (Low Energy) Single Mode Module
Overview of SESUB-PAN-D14580
FEATURES
Ultra small package - Ideal for for wearable devices
Space saving Ultra small package 3.5 x 3.5 x 1.0mm (TYP)
Packaged in 36 pin solder bumped BGA with 0.5mm pitch
Compatible with Bluetooth^® Smart Ready products
ARM Cortex-M0 32bit high performance microcontroller
32kB OTP programmable memory, 84kB ROM for BT stack
42kB System SRAM, 8kB Retention SRAM
External antenna connection allows design flexibility for improved performance.
8.5mm
Discrete Solution
72.3mm²
Space Saving
–83%
∗
1SPEVDUJPO
1BSU
JT
PWFS
NPMEFE
3.5mm
0.5mm pitch
Solder Bumped BGA
36pins
SESUB-PAN-D14580
12.3mm²
APPLICATION
Healthcare/sports & fitness equipment
(Example: Activity mass meter, thermometer, sphygmomanometer, blood
oximeter, blood glucose meter, heart rate meter, biometrics)
Wearable devices
(Example: Wristband, watch, ring, glasses, shoes, hat, shirt)
Home entertainment equipment
(Example: Remote control, sensor tag, toys, lighting products)
PC peripheral applications
(Example: Mouse, key board, stylus, presentation pointerʣ
Bluetooth^® and Bluetooth^® Low Energy are the standards established by Bluetooth Special Interest Group (SIG).
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
For product inquiries: [e-mail]
20150928 / sesub-pan-d14580_en.fm