S07K130GS2 Datasheet, PDF (20/46 Pages) TDK Electronics – Leaded varistors, StandarD series

Leaded varistors
StandarD series
B722*
Test
Solderability
Resistance to soldering
heat
Tensile strength
Test methods/conditions
Requirement
IEC 60068-2-20, test Ta,
The inspection shall be
method 1 with modified conditions for ^{carried out under adequate}
lead-free solder alloys: 245 °C, 3 s:
light with normal eyesight or
with the assistance of a
After dipping the terminals to a depth of _{magnifier capable of giving}
approximately 3 mm from the body in a _{a magnification of 4 to}
soldering bath of 245 °C for 3 s, the
10 times. The dipped
terminals shall be visually examined. _{surface shall be covered}
with a smooth and bright
solder coating with no more
than small amounts of
scattered imperfections
such as pinholes or
un-wetted or de-wetted
areas. These imperfections
shall not be concentrated in
one area.
IEC 60068-2-20, test Tb, method 1A, |∆V/V (1 mA)| ≤5%
260 °C, 10 s:
No visible damage
Each lead shall be dipped into a solder
bath having a temperature of 260 ±5 °C
to a point 2.0 to 2.5 mm from the body
of the specimen, be held there for
10 ±1 s and then be stored at room
temperature and normal humidity for
1 to 2 h.
The change of V_V shall be measured
and the specimen shall be visually
examined.
IEC 60068-2-21, test Ua1
|∆V/V (1 mA)| ≤5%
After gradually applying the force
specified below and keeping the unit
fixed for 10 s, the terminal shall be
visually examined for any damage.
No break of solder joint,
no wire break
Force for wire diameter:
0.6 mm = 10 N
0.8 mm = 10 N
1.0 mm = 20 N
Please read Cautions and warnings and
Important notes at the end of this document.
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