C0402C0G1C560JT Datasheet, PDF (18/34 Pages) TDK Electronics – MULTILAYER CERAMIC CHIP CAPACITORS

No. Process
3 Designing
P.C.board
Condition
5) Mechanical stress varies according to location of chip capacitors on the P.C.board.
Perforation
E
D
C
A
B
Slit
6) Layout recommendation
Example
Use of common
solder land
The stress in capacitors is in the following order.
A>B=C>D>E
Soldering with
chassis
Use of common
solder land with
other SMD
Need to
avoid
Lead wire _Chassis
chip _Solder
Excessive solder
Solder
land
PCB Adhesive
¹
Solder land
Excessive solder
Missing
solder
Solder land
Recommen-
dation
Lead wire
Solder resist
Solder resist
²
² > ¹
Solder resist
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