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C0402C0G1C470JT Datasheet, PDF (18/34 Pages) TDK Electronics – MULTILAYER CERAMIC CHIP CAPACITORS | |||
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No. Process
3 Designing
P.C.board
Condition
5) Mechanical stress varies according to location of chip capacitors on the P.C.board.
Perforation
E
D
C
A
B
Slit
6) Layout recommendation
Example
Use of common
solder land
The stress in capacitors is in the following order.
A>B=C>D>E
Soldering with
chassis
Use of common
solder land with
other SMD
Need to
avoid
Lead wire Chassis
chip Solder
Excessive solder
Solder
land
PCB Adhesive
î1
Solder land
Excessive solder
Missing
solder
Solder land
Recommen-
dation
Lead wire
Solder resist
Solder resist
î2
î2 > î1
Solder resist
â 17 â
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