C0402C0G1C470JT Datasheet, PDF (16/34 Pages) TDK Electronics – MULTILAYER CERAMIC CHIP CAPACITORS

No.
Process
2 Circuit design
 Caution
Condition
2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied, the
reliability of the capacitors may be reduced.
3) The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
3 Designing
P.C.board
2-3. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
The amount of solder at the terminations has a direct effect on the reliability of the
capacitors.
1) The greater the amount of solder, the higher the stress on the chip capacitors,
and the more likely that it will break. When designing a P.C.board, determine the
shape and size of the solder lands to have proper amount of solder on the
terminations.
2) Avoid using common solder land for multiple terminations and provide individual
solder land for each terminations.
3) Size and recommended land dimensions.
Chip capacitors _{Solder land}
C
Solder resist
Flow soldering
Type
Symbol
A
B
C
B
C1608
(CC0603)
0.7 - 1.0
0.8 - 1.0
0.6 - 0.8
A
C2012
(CC0805)
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
(mm)
C3216
(CC1206)
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
Reflow soldering
Type C0402
Symbol
(CC01005)
A
0.15 - 0.25
B
0.15 - 0.25
C
0.15 - 0.25
C0603
(CC0201)
0.25 - 0.35
0.2 - 0.3
0.25 - 0.35
C1005
(CC0402)
0.3 - 0.5
0.35 - 0.45
0.4 - 0.6
C1608
(CC0603)
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
(mm)
C2012
(CC0805)
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
Type
Symbol
A
B
C
C3216
(CC1206)
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
C3225
(CC1210)
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
C4532
(CC1812)
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
C5750
(CC2220)
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
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