TCS3200 Datasheet, PDF (9/14 Pages) TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS – COLOR LIGHT-TO-FREQUENCY CONVERTER

TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099A − AUGUST 2011
MECHANICAL INFORMATION
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The TCS3200 has an 8 × 8 array of photodiodes with a total size of 1 mm
by 1 mm. The photodiodes are 110 μm × 110 μm in size and are positioned on 134 μm centers.
PACKAGE D
NOTE B
TOP VIEW
2.12
+ 0.250
3.00 + 0.250
PLASTIC SMALL-OUTLINE
BOTTOM VIEW
PIN 1
6 y 1.27
PIN 1
8 y ^0.510
0.330
0.50
0.25
1.75
1.35
j 2.8 TYP
CLEAR WINDOW
END VIEW
0.88 TYP TOP OF
455
SENSOR DIE
A
4.00
3.80
6.20
5.80
SIDE VIEW
5.00
4.80
5.3
MAX
DETAIL A
0.25
0.19
Pb
1.27
0.25
0.41
0.10
NOTES: A. All linear dimensions are in millimeters.
B. The center of the 1-mm by 1-mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
C. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. This drawing is subject to change without notice.
Figure 7. Package D — TCS3200 Plastic Small Outline IC Packaging Configuration
The LUMENOLOGY r Company
r
Copyright E 2011, TAOS Inc.
r
www.taosinc.com
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