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TL75LPXXQ Datasheet, PDF (3/15 Pages) Texas Instruments – LOW-DROPOUT VOLTAGE REGULATORS
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TL75LPxxQ SERIES
TL75LPxxY SERIES
LOWĆDROPOUT VOLTAGE REGULATORS
SLVS073A − SEPTEMBER 1992 − REVISED AUGUST 1995
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC, (See Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 V
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C
Continuous total power dissipation (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to network terminal ground.
2. Refer to Figures 1 and 2 to avoid exceeding the design maximum virtual junction temperature; these ratings should not be exceeded.
Due to variation in individual device electrical characteristics and thermal resistance, the built-in thermal overload protection may
be activated at power levels slightly above or below the rated dissipation.
DISSIPATION RATING TABLE
POWER RATING
T ≤ 25°C
DERATING FACTOR
T = 70°C
T = 85°C
T = 125°C
PACKAGE
AT
POWER RATING ABOVE T = 25°C POWER RATING POWER RATING POWER RATING
TA
PW
TC
TP‡
828 mW
4032 mW
2475 mW
6.62 mW/°C
32.2 mW/°C
19.8 mW/°C
530 mW
2583 mW
1584 mW
431 mW
2100 mW
1287 mW
166 mW
812 mW
495 mW
‡ RθJP is the thermal resistance between the junction and the device pin. To determine the virtual junction temperature (TJ) relative to the device
pin temperature, the following calculations should be used: TJ = PD x RθJP + TP, where PD is the internal power dissipation of the device and TP
is the device pin temperature at the point of contact to the printed wiring board. The RθJP for the TL75LPxx series is 50.5°C/W.
2400
2200
2000
MAXIMUM CONTINUOUS DISSIPATION
vs
FREE-AIR TEMPERATURE
1800
1600
1400
1200
1000
800
600
400
200
0
25
RθJA = 151°C/W
50
75
100
125
150
TA − Free-Air Temperature − °C
Figure 1
MAXIMUM CONTINUOUS DISSIPATION
vs
CASE TEMPERATURE
4800
4400
4000
3600
3200
2800
2400
2000
1600
1200
800
RθJC = 31°C/W
400
0
25
50
75
100
125
150
TC − Case Temperature − °C
Figure 2
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