TL75LPXXQ Datasheet, PDF (2/15 Pages) Texas Instruments – LOW-DROPOUT VOLTAGE REGULATORS

TL75LPxxQ SERIES
ą
TL75LPxxY SERIES
LOWĆDROPOUT VOLTAGE REGULATORS
SLVS073A − SEPTEMBER 1992 − REVISED AUGUST 1995
functional block diagram
INPUT
ENABLE
Enable
Current
Limiting
28 V
Bandgap
−
+
Overvoltage/
Thermal
Shutdown
OUTPUT
GND/HEAT SINK
TL75LPxxY chip information
This chip, when properly assembled, displays characteristics similar to the TL75LPxx. Thermal compression
or ultrasonic bonding can be used on the doped aluminum bonding pads. The chip can be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(5)
(6) ⁽⁴⁾
92
(3)
(1) (2)
123
(1)
INPUT
TL75LPxxY
(5)OUTPUT
(4)OUTPUT
SENSE
(3)
(6)
(2)
ENABLE POWER SIGNAL
GND GND
CHIP THICKNESS: 11 MILS TYPICAL
BONDING PADS: 7 X 7 MILS MINIMUM
TJ max = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
NOTE A. NOTE: SIGNAL GND and POWER
GND must be tied together as close to
device as possible. OUTPUT and
OUTPUT SENSE should be tied
together.
3−2
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
• POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443