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TL2218-285_14 Datasheet, PDF (3/13 Pages) Texas Instruments – EXCALIBUR CURRENT-MODE SCSI TERMINATOR
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functional block diagram (each channel)
TL2218Ć285, TL2218Ć285Y
EXCALIBUR CURRENTĆMODE SCSI TERMINATOR
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SLVS072C − DECEMBER 1992 − REVISED OCTOBER 1995
1, 20
TERMPWR
Feedback
19
DISABLE
Vref
Active
Negation
Clamp
4
D0
Thermal
Regulation
Common to All Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
(see Figures 1, 2, and 3)†
Continuous termination voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 V
Continuous output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5.5 V
Continuous disable voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5.5 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −60°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
POWER RATING
T ≤ 25°C
DERATING FACTOR
T = 70°C
T = 85°C
T = 125°C
PACKAGE
AT
POWER RATING ABOVE T = 25°C POWER RATING POWER RATING POWER RATING
TA
828 mW
6.62 mW/°C
530 mW
430 mW
166 mW
PW
TC
4032 mW
32.2 mW/°C
2583 mW
2100 mW
812 mW
TL‡
2475 mW
19.8 mW/°C
1584 mW
1287 mW
495 mW
‡ RθJL is the thermal resistance between the junction and device lead. To determine the virtual junction temperature (TJ) relative to the device lead
temperature, the following calculations should be used: TJ = PD x RθJL + TL , where PD is the internal power dissipation of the device and TL is
the device lead temperature at the point of contact to the printed wiring board. RθJL is 50.5°C/W.
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