TL2218-285_14 Datasheet, PDF (2/13 Pages) Texas Instruments – EXCALIBUR CURRENT-MODE SCSI TERMINATOR

TL2218Ć285, TL2218Ć285Y
ą
EXCALIBUR CURRENTĆMODE SCSI TERMINATOR
ą
SLVS072C − DECEMBER 1992 − REVISED OCTOBER 1995
AVAILABLE OPTIONS
TJ
SURFACE MOUNT
(PW)†
CHIP FORM
(Y)
0°C to 125°C TL2218-285PWLE
TL2218-285Y
† _{The PW package is only available left-end taped and reeled.}
TL2218-285Y chip information
This chip, when properly assembled, displays characteristics similar to the TL2218-285. Thermal compression
or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(1) (20)
(19)
(4)
(5)
161
(17)
19
DISABLE
Vref
(16)
Common to All Channels
1, 20
TERMPWR
Feedback
Active
Negation
Clamp
4 _D0
Thermal
Regulation
(6)
(7)
(8)
(10) (11)
84
(14)
(13)
CHIP THICKNESS: 11 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
8−2
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