OPA2333AIDGKR Datasheet, PDF (12/28 Pages) Texas Instruments – 1.8V, microPOWER CMOS OPERATIONAL AMPLIFIERS Zero-Drift Series

OPA333
OPA2333
SBOS351C – MARCH 2006 – REVISED MAY 2007
DFN PACKAGE
The OPA2333 is offered in an DFN-8 package (also
known as SON). The DFN is a QFN package with
lead contacts on only two sides of the bottom of the
package. This leadless package maximizes board
space and enhances thermal and electrical
characteristics through an exposed pad.
DFN packages are physically small, have a smaller
routing area, improved thermal performance, and
improved electrical parasitics. Additionally, the
absence of external leads eliminates bent-lead
issues.
The DFN package can be easily mounted using
standard printed circuit board (PCB) assembly
techniques. See Application Note QFN/SON PCB
Attachment (SLUA271) and Application Report Quad
Flatpack No-Lead Logic Packages (SCBA017), both
available for download at www.ti.com.
The exposed leadframe die pad on the bottom of
the package should be connected to V– or left
unconnected.
www.ti.com
DFN LAYOUT GUIDELINES
The exposed leadframe die pad on the DFN package
should be soldered to a thermal pad on the PCB. A
mechanical drawing showing an example layout is
attached at the end of this data sheet. Refinements
to this layout may be necessary based on assembly
process requirements. Mechanical drawings located
at the end of this data sheet list the physical
dimensions for the package and pad. The five holes
in the landing pattern are optional, and are intended
for use with thermal vias that connect the leadframe
die pad to the heatsink area on the PCB.
Soldering the exposed pad significantly improves
board-level reliability during temperature cycling, key
push, package shear, and similar board-level tests.
Even with applications that have low-power
dissipation, the exposed pad must be soldered to the
PCB to provide structural integrity and long-term
reliability.
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