SN74LVC3G07-Q1 Datasheet, PDF (1/9 Pages) Texas Instruments – TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

SN74LVC3G07-Q1
www.ti.com.................................................................................................................................................... SCES616B – OCTOBER 2004 – REVISED APRIL 2008
TRIPLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
FEATURES
1
• Qualified for Automotive Applications
• Supports 5-V V_CC Operation
• Max t_pd of 3.7 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• Input and Open-Drain Output Accepts
Voltages up to 5.5 V
• Typical V_OLP (Output Ground Bounce) <0.8 V at
V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot) >2 V at
V_CC = 3.3 V, T_A = 25°C
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCU PACKAGE
(TOP VIEW)
1A 1
3Y 2
2A 3
GND 4
8
V_CC
7 1Y
6 3A
5 2Y
See mechanical drawing for dimensions.
DESCRIPTION/ORDERING INFORMATION
This triple buffer/driver is designed for 1.65-V to 5.5-V V_CC operation.
The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–40°C to 125°C
VSSOP – DCU
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
Reel of 3000
SN74LVC3G07QDCURQ1
TOP-SIDE MARKING⁽³⁾
C07_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
FUNCTION TABLE
(EACH BUFFER/DRIVER)
INPUT
A
H
L
OUTPUT
Y
H
L
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2008, Texas Instruments Incorporated