NQ15W50SGA30 Datasheet, PDF (10/11 Pages) SynQor Worldwide Headquarters – SMT Surface Mount

Technical Specification
Input: 6.0 - 15.0V
Outputs: 0.8 - 5.0V
Current: 30A
Package: SMT
Reflow Soldering Guidelines: Figure J
shows a typical reflow profile for a eutectic
solder process. Due to variations in customer
applications, materials and processes, it is not
feasible for SynQor to recommend a specific
reflow profile. The customer should use this
profile as a guideline only. Since the NiQor sur-
face mount modules have a larger thermal mass
and lower thermal resistance than standard SMT
components, it may be necessary to optimize
the solder reflow profile based on limitations of
the other components on the customer board.
Sufficient reflow time must be allowed to fuse the
plating on the connection to ensure a reliable
solder joint. The solder reflow profile should
be confirmed by accurately measuring the SMT
interconnect leads. Maximum case temperature
of 260°C (exposure for 5 seconds or less) is not
exceeded for the NiQor units.
Moisture Sensitivity: The NiQor surface
mount modules have an MSL rating 1 per IPC/
JEDEC J-STD-033A.
Maximum Temperature (+210-260^oC)
Eutectic Solder Melting Point (+183^oC)
(+150-155^oC)
Pre-heat
• < 2.5^oC/sec
Soak
• 0.5-0.6^oC/sec
• 60 to 90 sec.,
typ., 2 min max
Reflow
• 1.3-1.6^oC/sec
• 30 to 60 sec., typ.,
90 sec max
2 to 4 min.
Figure J: Typical Eutectic (96.5Sn/3.0Ag/0.5Cu) Solder Profile
Cleaning and Drying: When possible, a no-clean solder
paste system should be used to solder the NiQor SMT units to
their application board. The modules are suitable for aque-
ous washing, however, the user must ensure sufficient drying
to remove all water from the converter before powering up.
Inadequate cleaning and drying can affect the reliability of the
converter and the testing of the final assembly.
Cool Down
Product # NQ15W50SGA30
Phone [phone]
www.synqor.com
Doc.# 005-2NS163E Rev. C
10/03/08
Page 10