SMH4812_09 Datasheet, PDF (17/18 Pages) Summit Microelectronics, Inc. – Distributed Power Hot-Swap Controller

16 PIN SOIC PACKAGE
0.390 ± 0.005
16
9
SMH4812
Preliminary
.0085 ± .0010
(After Plating)
SOIC ¹⁶
Pin 1 Index
1
8
0.05 BSC
0.016 ± 0.003
0.151 ± 0.005
155 ± 0.005
0 ±8
DETAIL A
.004
.007 ± .003
Note:
7 ±1
7 ±1
45 ± 1
.016 ±.002 0.024 ± 0.002
0.054 ± 0.005
0.069 MAX
7 ±1
0.390 ± 0.005
1. Reference: JEDEC publication MS-012 PTX 360-120
2. Unit: Inches
3. Mold flash, protrusion & gate burr shall not exceed 0.006 inch per side.
0.007 ± 0.003
0.023 ± 0.005
0.041
DETAIL A
2055 SOIC 1.0
2055 4.1 03/27/09
SUMMIT MICROELECTRONICS, Inc.
17