|
STM32F101XC Datasheet, PDF (99/106 Pages) STMicroelectronics – High-density access line, ARM-based 32-bit MCU with 256 to 512 KB Flash, 9 timers, 1 ADC and 10 communication interfaces | |||
|
◁ |
STM32F101xC, STM32F101xD, STM32F101xE
Package characteristics
6.2
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 10: General operating conditions on page 38.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max à ïJA)
Where:
â TA max is the maximum ambient temperature in °C,
â ïJA is the package junction-to-ambient thermal resistance, in °C/W,
â PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
â PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = ïï (VOL Ã IOL) + ï((VDD â VOH) Ã IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Table 63. Package thermal characteristics
Symbol
Parameter
Thermal resistance junction-ambient
LQFP144 - 20 x 20 mm / 0.5 mm pitch
ïJA
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
Value
30
46
45
Unit
°C/W
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Doc ID 14610 Rev 7
99/106
|
▷ |