TDA7479_08 Datasheet, PDF (9/12 Pages) STMicroelectronics – Single chip RDS demodulator + filter

TDA7479
5
Package information
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK^®
packages. ECOPACK^® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 4. SO16 mechanical data and package dimensions
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A 2.35
2.65 0.093
0.104
A1 0.10
0.30 0.004
0.012
B 0.33
0.51 0.013
0.200
C 0.23
0.32 0.009
0.013
D ^{(1) 10.10}
10.50 0.398
0.413
E 7.40
7.60 0.291
0.299
e
1.27
0.050
H 10.0
10.65 0.394
0.419
h 0.25
0.75 0.010
0.030
L 0.40
1.27 0.016
0.050
k
0˚ (min.), 8˚ (max.)
ddd
0.10
0.004
(1) “D” dimension does not include mold flash, protusions or gate
burrs. Mold flash, protusions or gate burrs shall not exceed
0.15mm per side.
OUTLINE AND
MECHANICAL DATA
SO16 (Wide)
0016021 C
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