ESDAVLC8-1BT2Y Datasheet, PDF (9/13 Pages) STMicroelectronics – Single-line bidirectional protection

ESDAVLC8-1BT2Y
Recommendation on PCB assembly
3
Recommendation on PCB assembly
3.1
Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 21. Stencil opening dimensions
L
TW
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
Aspect Ratio
=
W-----
T
≥
1.5
Aspect Area = _2----T---L-(---L-^×----+-W----W------₎ ≥ 0.66
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 22. Recommended stencil window position in mm (inches)
0.40
(0.016)
0.55
(0.022)
0.014
0.014
(0.00055) (0.00055)
0.522
(0.021)
Lead footprint on PCB
Stencil window opening
DocID025558 Rev 2
9/13
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