ESDAVLC8-1BT2Y Datasheet, PDF (11/13 Pages) STMicroelectronics – Single-line bidirectional protection

ESDAVLC8-1BT2Y
Recommendation on PCB assembly
3.5
Reflow profile
Figure 23. ST ECOPACK^® recommended soldering reflow profile for PCB mounting
Temperature (°C)
250
200
150
100
0.9 °C/s
50
0
30
60
90
240-245 °C
2 - 3 °C/s
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
Time (s)
120 150 180 210 240 270 300
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
DocID025558 Rev 2
11/13
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