TDA7513T_07 Datasheet, PDF (82/84 Pages) STMicroelectronics – Single chip FM/AM tuner with stereo decoder and audio processor

Package information
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Package information
TDA7513T
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 21. LQFP80 mechanical data & package dimensions
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A
1.600
0.0630
A1 0.050
0.150 0.0020
0.0059
A2 1.350 1.400 1.450 0.0531 0.0551 0.0571
b 0.220 0.320 0.380 0.0087 0.0126 0.0150
c 0.090
0.200 0.0035
0.0079
D 15.800 16.000 16.200 0.6220 0.6299 0.6378
D1 13.800 14.000 14.200 0.5433 0.5512 0.5591
D3
12.350
0.4862
E 15.800 16.000 16.200 0.6220 0.6299 0.6378
E1 13.800 14.000 14.200 0.5433 0.5512 0.5591
E3
12.350
0.4862
e
0.650
0.0256
L 0.450 0.600 0.750 0.0177 0.0236 0.0295
L1
1.000
0.0394
k
0˚ (min.); 3.5˚ (typ,); 7˚ (max.)
ccc
0.100
0.0039
OUTLINE AND
MECHANICAL DATA
LQFP80 (14x14x1.40mm)
Low profile Quad Flat Package
82/84
0062342 D