STM32F101RBH6 Datasheet, PDF (80/90 Pages) STMicroelectronics – Medium-density access line, ARM-based 32-bit MCU with 64 or 128 KB Flash, 6 timers, ADC and 7 communication interfaces

Package characteristics
STM32F101x8, STM32F101xB
6.2
Thermal characteristics
The maximum chip junction temperature (T_Jmax) must never exceed the values given in
Table 8: General operating conditions on page 33.
The maximum chip-junction temperature, T_J max, in degrees Celsius, may be calculated
using the following equation:
T_J max = T_A max + (P_D max x _JA)
Where:
 T_A max is the maximum ambient temperature in C,
 _JA is the package junction-to-ambient thermal resistance, in C/W,
 P_D max is the sum of P_INT max and P_I/O max (P_D max = P_INT max + P_I/Omax),
 P_INT max is the product of I_DD and V_DD, expressed in Watts. This is the maximum chip
internal power.
P_I/O max represents the maximum power dissipation on output pins where:
P_I/O max = (V_OL × I_OL) + ((V_DD – V_OH) × I_OH),
taking into account the actual V_OL / I_OL and V_OH / I_OH of the I/Os at low and high level in the
application.
Table 52. Package thermal characteristics
Symbol
Parameter
Value
Thermal resistance junction-ambient
LQFP 100 - 14 x 14 mm / 0.5 mm pitch
46
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
45
_JA
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm / 0.5 mm pitch
55
Thermal resistance junction-ambient
UFQFPN 48 - 6 x 6 mm / 0.5 mm pitch
32
Thermal resistance junction-ambient
VFQFPN 36 - 6 x 6 mm / 0.5 mm pitch
18
Unit
°C/W
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
80/90
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