TDA7265SA Datasheet, PDF (8/12 Pages) STMicroelectronics – 18W+18W STEREO AMPLIFIER WITH MUTE & ST-BY

TDA7265SA
Figure 16. SVR vs. Frequency
Figure 18. Power Dissipation vs. Output Power
Figure 17. Attenuation vs. Pin #5 Voltage
Figure 19. Power Dissipation vs. Output Power
6 HEAT SINK DIMENSIONING:
In order to avoid the thermal protection intervention, that is placed approximatively at T_j = 150°C, it is im-
portant the dimensioning of the Heat Sinker R_Th (°C/W).
The parameters that influence the dimensioning are:
– Maximum dissipated power for the device (P_dmax)
– Max thermal resistance Junction to case (R_{Th j-c})
– Max. ambient temperature T_{amb max}
– Quiescent current I_q (mA)
Example:
V_CC = ±17.5V, R_load = 8ohm, R_{Th j-c} = 3 °C/W , T_{amb max} = 50°C
P_dmax
=
(N°
channels) ·
------²----^V----^c---^c--²-------
Π² ⋅ R_load
+ I_q ⋅
V_cc
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