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ESDAVLC5-1BF4 Datasheet, PDF (8/10 Pages) STMicroelectronics – Low clamping, very low capacitance bidirectional single line ESD protection | |||
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Recommendation on PCB assembly
ESDAVLC5-1BF4
3.5
Note:
Reflow profile
Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting
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Minimize air convection currents in the reflow oven to avoid component movement.
8/10
DocID028245 Rev 1
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