BAT30F4 Datasheet, PDF (8/10 Pages) STMicroelectronics – Negligible switching losses

Recommendation on PCB assembly
BAT30F4
3.5
Note:
Reflow profile
Figure 14. ST ECOPACK^® recommended soldering reflow profile for PCB mounting
Temperature (°C)
250
200
150
100
0.9 °C/s
50
0
30
60
90
240-245 °C
2 - 3 °C/s
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
Time (s)
120 150 180 210 240 270 300
Minimize air convection currents in the reflow oven to avoid component movement.
8/10
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