STM8L101X1 Datasheet, PDF (77/88 Pages) STMicroelectronics – Auto-wakeup unit

STM8L101x1 STM8L101x2 STM8L101x3
Package information
Table 43. TSSOP20 - 20-lead thin shrink small package mechanical data (continued)
mm
inches⁽¹⁾
Dim.
Min
Typ
Max
Min
Typ
Max
k
0°
aaa
-
Number of pins
-
8°
0°
-
0.100
-
20
-
8°
-
0.0039
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per
side.
Figure 50. TSSOP20 recommended footprint






 

1. Dimensions are in millimeters.




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