SM6T56CA Datasheet, PDF (7/10 Pages) STMicroelectronics – Transil

SM6T
3
Packaging information
Packaging information
● Case: JEDEC DO-214AA molded plastic over planar junction
● Terminals: solder plated, solderable as per MIL-STD-750, Method 2026
● Polarity: for unidirectional types the band indicates cathode
● Flammability: epoxy meets UL 94, V0
● RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Table 4. SMB dimensions
E1
D
E
A1
C
A2
L
Dimensions
Ref. Millimeters
Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.201 0.220
b
E1 4.05 4.60 0.159 0.181
L 0.75 1.50 0.030 0.059
Figure 13. SMB footprint dimensions in Figure 14. Marking layout⁽¹⁾
mm (inches)
1.62 2.60 1.62
(0.064) (0.102) (0.064)
2.18
(0.086)
5.84
(0.23)
Cathode bar (unidirectional devices only )
e
xxx
z y ww
e: ECOPACK compliance
XXX: Marking
Z: Manufacturing location
Y: Year
WW: Week
1. Marking layout can vary according to assembly location.
Doc ID 3082 Rev 9
7/10