SM6T56CA Datasheet, PDF (5/10 Pages) STMicroelectronics – Transil

SM6T
Characteristics
Figure 6.
Capacitance versus reverse
applied voltage for unidirectional
types (typical values)
C (pF)
10000
F=1 MHz
V_osc=30 mV_RMS
T_j=25 °C
1000
SM6T6V8A
SM6T15A
SM6T30A
100
SM6T68A
SM6T100A
10
1
V _R (V)
10
SM6T220A
100
1000
Figure 7.
Capacitance versus reverse applied
voltage for bidirectional types
(typical values)
C (pF)
10000
SM6T6V8CA
F=1 MHz
V_osc=30 mV_RMS
T_j=25 °C
1000
SM6T15CA
SM6T30CA
SM6T68CA
100
SM6T100CA
10
1
SM6T220CA
V _R (V)
10
100
1000
Figure 8.
I_FM(A)
1.0E+02
Peak forward voltage drop versus
peak forward current
(typical values)
1.0E+01
T_j =125 °C
Figure 9.
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Zth (j-a)/Rth (j-a)
1.00
Recommended pad layout
Printed circuit board FR4, copper thickness = 35 µm
1.0E+00
T_j =25 °C
0.10
1.0E-01
V_FM(V)
tp s
1.0E-02
0.01
0.0
0.5
1.0
1.5
2.0
2.5
3.0
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
R_th(j-a) (°C/W)
110
100
(printed circuit board FR4,
90
copper thickness = 35 µm)
80
70
60
50
40
30
20
10
S_Cu(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 11. Leakage current versus junction
temperature (typical values)
I_R (nA)
1.E+03
1.E+02
V_R=V_RM
V_RM < 10 V
1.E+01
1.E+00
1.E-01
25
V_R=V_RM
V_RM ≥ 10 V
50
75
100
Tj (° C)
125
150
Doc ID 3082 Rev 9
5/10