ESDAULC6-1U2 Datasheet, PDF (7/10 Pages) STMicroelectronics – Single-line unidirectional ESD protection for high speed interface

ESDAULC6-1U2
Recommendation on PCB assembly
4
Recommendation on PCB assembly
4.1
Stencil opening design
Figure 12. Recommended stencil windows position (dimensions in mm)
0.425
1.05
0.425
0.225
0.30
0.040
0.065 0.20
Footprint
0.038
0.320 0.038
Stencil window
4.2
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed
4. Solder paste with fine particles: powder particle size is 20-45 µm.
Doc ID 023270 Rev 1
7/10