CPL-WBF-00D3 Datasheet, PDF (7/9 Pages) STMicroelectronics – Flip Chip package

CPL-WBF-00D3
Package information
Figure 14. Tape and reel specifications
Dot identifying Pin A1 location
2.0
0.22
Ø 1.55
4.0
ST
ST
ST
xxz
xxz
xxz
yww
yww
yww
1.2
4.0
0.71
All dimensions are typical values in mm
User direction of unreeling
Note:
More information is available in the STMicroelectronics Application note:
AN2348: “IPAD™ 400 µm Flip Chip: package description and recommendations for use”
DocID023414 Rev 2
7/9