CPL-WBF-00D3 Datasheet, PDF (1/9 Pages) STMicroelectronics – Flip Chip package

CPL-WBF-00D3
Wide band directional coupler with ISO port
Features
 50  nominal input / output impedance
 Wide operating frequency range
(698 MHz to 2700 MHz)
 Low insertion loss
 30 dB coupling factor with high flatness
 High directivity
 High ESD robustness (IEC 61000-4-2 level 4)
 Flip Chip package
 Small footprint
Benefits
 Very low profile (< 560 µm thickness after
reflow)
 Lead-free package
 High RF performance
 RF module size reduction
 50  nominal input / output impedance
 Fully symmetrical design
Applications
 Quad-band power amplifier module
 Quad-band front end module
 GSM / WCDMA / LTE mobile phone
Datasheet - production data
Flip Chip (6 bumps)
Figure 1. Pin configuration (top view)
OUT
ISO
GND
GND
CPL
IN
Description
The CPL-WBF-00D3 is a wide-band directional
coupler designed to measure RF antenna output
power in GSM / WCDMA / TD-SCDMA / LTE
applications. This coupler has been customized
for wide band operating frequencies (EGSM,
CELL, PCS, DCS, TD-SCDMA, WCDMA and
LTE) with less than 0.30 dB insertion losses in the
bandwidth (698 MHz to 2700 MHz).
The CPL-WBF-00D3 has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non-conductive glass
substrate to optimize RF performance. The
device is delivered 100% tested in tape and reel.
August 2013
This is information on a product in full production.
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