VL6524 Datasheet, PDF (66/70 Pages) STMicroelectronics – VGA single-chip camera module

Package outline
VL6524/VS6524
14.2
LGA
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 41. LGA package mechanical data
Data book (mm)
Symbol
Min.
Typ.
A
1.80
1.90
A4
0.35
0.4
A5
0.7
0.8
B1
2.0
B2
3.5
B3
0.55
b
0.25
0.30
D
9.90
10.00
D1
9.60
9.70
D2
5
D4
5.4
e
0.8
E
9.90
10.00
E1
9.60
9.70
E2
5
E4
4.5
G
1.0
1.1
G1
1
G2
0.3
0.4
G3
0.8
0.9
G4
0.8
H
0.8
0.9
H1
0.8
H2
0.3
0.4
I
3.95
4.05
J
4.1
K
0.3
Max.
2.00
0.45
0.9
0.35
10.10
9.80
10.10
9.80
1.2
0.5
1.0
1.0
0.5
4.15
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