ESDLIN1524BJ Datasheet, PDF (6/7 Pages) STMicroelectronics – TRANSIL™ diode for ESD protection

Ordering information
Figure 7. SOD-323 footprint (dimensions in millimeters)
3.20
0.54
1.06 1.08 1.06
ESDLIN1524BJ
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
5
Ordering information
Part number
ESDLIN1524BJ
Marking
24
Package
SOD-323
Weight
5 mg
Base qty
3000
Delivery mode
Tape and reel
6
Revision history
Date
28-Aug-2006
22-Sep-2006
Revision
Changes
1
Initial release.
2
Added Figure 6 Placement and layout recommendations.
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