ESDAXXXP6 Datasheet, PDF (6/8 Pages) STMicroelectronics – Transil™ array for ESD protection

Package information
ESDAxxxP6
Table 4. SOT-666IP Dimensions
Dimensions
b1
L1
L4
L3
b
D
A
e
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A 0.45
0.60 0.018
0.024
A3 0.08
0.18 0.003
0.007
b 0.17
0.34 0.007
0.013
E1
b1 0.19 0.27 0.34 0.007 0.011 0.013
D 1.50
1.70 0.059
0.067
E 1.50
1.70 0.059
0.067
E
L2
A3
E1 1.10
1.30 0.043
0.051
e
0.50
0.020
L1
0.19
0.007
L2 0.10
0.30 0.004
0.012
L3
0.10
0.004
L4
0.60
0.024
Figure 12. SOT-666IP Footprint (dimensions in mm)
0.50
0.30
0.21
1.40
0.99
0.62 2.60
0.20
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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