TDA7529 Datasheet, PDF (58/60 Pages) STMicroelectronics – RF front-end for AM/FM DSP car-radio with IF sampling

Package information
8
Package information
TDA7529
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 18. LQFP64 (10x10x1.4mm) exposed pad down mechanical data and package
dimensions (exposed pad size for D2 and E2: 4.5mm max.)
mm
inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A1 0.050
0.150 0.0020
0.0059
A2 1.350 1.400 1.450 0.0531 0.0551 0.0571
b 0.170 0.220 0.270 0.0067 0.0087 0.0106
c 0.090
0.200 0.0035
0.0079
D 11.800 12.000 12.200 0.4646 0.4724 0.4803
D1 9.800 10.000 10.200 0.3858 0.3937 0.4016
D2
According to Pad size
D3
7.500
0.2953
E 11.800 12.000 12.200 0.4646 0.4724 0.4803
E1 9.800 10.000 10.200 0.3858 0.3937 0.4016
E2
According to Pad size
E3
7.500
0.2953
e
0.500
0.0197
L 0.450 0.600 0.750 0.0177 0.0236 0.0295
L1
1.000
0.0394
k
3.500 7.000
0.1378 0.2756
ccc
0.080
0.0031
Note: 1. Exact shape of each corner is optional.
OUTLINE AND
MECHANICAL DATA
LQFP64 (10x10x1.4mm)
Exposed Pad Down
58/60
7278841 C