STW4510 Datasheet, PDF (52/57 Pages) STMicroelectronics – 2 step-down DC/DC converters / 5 LDO power management

Package mechanical data
7
Package mechanical data
STw4510
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
7.1
TFBGA 84 balls 6 mm x 6 mm x 1.2 mm
See Figure 10: TFBGA84 6 mm x 6 mm x 1.2 mm outline drawing.
Table 32. TFBGA84 6 mm x 6 mm x 1.2 mm - 0.5mm ball pitch ^{(1) (2)}
Parameter
Min.
) _A
t(s _A1
0.20
uc _A2
rod ^b
0.25
P D
5.90
te ^D1
le _E
5.90
so E1
b _e
0.45
- ^O f
0.65
t(s) ^ddd
1. These measurements conform to JEDEC standards
Obsolete ^{Produc 2. Drawing dimensions}
Typ.
0.25
0.82
0.30
6.00
4.50
6.00
4.50
0.50
0.75
Max.
1.16
0.30
0.35
6.10
6.10
0.55
0.85
0.08
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
52/57