PD57060 Datasheet, PDF (5/12 Pages) STMicroelectronics – RF POWER TRANSISTORS The LdmoST Plastic FAMILY

TEST CIRCUIT SCHEMATIC
PD57060 - PD57060S
VGG+
+
RF
IN
+ _VDD
+
RF
OUT
NO TES:
1. DIMENSIONS AT COMPONENT SYMBOLS ARE REFERENCE FOR COMPONENT PLACEMENT.
2. GAP BETWEEN GROUND & TRANSMISSION LINE = 0.056 [1.42] +0.002 [0.05] -0.000 [0.00] TYP.
3. DIMENSIONS OF INPUT AND OUTPUT COMPONENT FROM EDGE OF TRANSMISSION LINES.
TEST CIRCUIT COMPONENT PART LIST
COMPONENT
DESCRIPTION
L1,L2
INDUCTOR, 5 TURNS AIR WOUND #22AWG, ID 0.059{1.49}, NYLON COATED
MAGNET WIRE
FB1,FB2
SHIELD BEAD SURFACE MOUNT EMI
R1
18 kΩ, 1 W SURFACE MOUNT CHIP RESISTOR
R2
4.7 MΩ, 1 W SURFACE MOUNT CHIP RESISTOR
R3
120 Ω, 2 W SURFACE MOUNT CHIP RESISTOR
C1,C2
3 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR
C3,C10,C11,C15
47 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR
C4,C9
0.8-8.0 pF GIGA TRIM VARIABLE CAPACITOR
C5,C6,C7,C8
7.5 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR
C12
1000 pF ATC 700B SURFACE MOUNT CERAMIC CHIP CAPACITOR
C13,C17
0.1 µF, 500 V SURFACE MOUNT CERAMIC CHIP CAPACITOR
C14
10 µF, 50 V ALUMINUM ELECTROLYTIC RADIAL LEAD CAPACITOR
C16
100 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR
C18
220 µF, 63 V ALUMINUM ELECTROLYTIC RADIAL LEAD CAPACITOR
BOARD
ROGER, ULTRA LAM 2000, THK 0.030”, εr = 2.55 2oz. ED Cu 2 SIDES.
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