EMIF02-AV01F3 Datasheet, PDF (5/7 Pages) STMicroelectronics – Dual audio and video line IPAD, EMI filter and ESD protection

EMIF02-AV01F3
Ordering information
Figure 11. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Figure 12. Marking
Dot
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
xxz
y _ww
Figure 13. Flip Chip tape and reel specification
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
1.01
Note:
0.71 ± 0.05
4 ± 0.1
All dimensions in mm
User direction of unreeling
Note: More information is available in the application note:
AN2348:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
4
Ordering information
Table 3. Ordering information
Order code
Marking
Package
EIMF02-AV01F3
HH
Flip Chip
Weight
1.4 mg
Base qty
5000
Delivery mode
Tape and reel 7”
5/7